• DocumentCode
    854579
  • Title

    A new measurement microphone based on MEMS technology

  • Author

    Scheeper, Patrick Richard ; Nordstrand, Børge ; Gullv, J.O. ; Liu, Bin ; Clausen, Thomas ; Midjord, Lise ; Storgaard-Larsen, Torben

  • Author_Institution
    Sonion, Orsteds Plads, Lyngby, Denmark
  • Volume
    12
  • Issue
    6
  • fYear
    2003
  • Firstpage
    880
  • Lastpage
    891
  • Abstract
    This paper presents a new type of measurement microphone that is based on MEMS technology. The silicon chip design and fabrication are discussed, as well as the specially developed packaging technology. The microphones are tested on a number of key parameters for measurement microphones: sensitivity, noise level, frequency response, and immunity to disturbing environmental parameters, such as temperature changes, humidity, static pressure variations, and vibration. A sensitivity of 22 mV/Pa (-33 dB re. 1 V/Pa), and a noise level of 23 dB(A) were measured. The noise level is 7 dB lower than state-of-the-art 1/4-inch measurement microphones. A good uniformity on sensitivity and frequency response has been measured. The sensitivity to temperature changes, humidity, static pressure variations and vibrations is fully comparable to the traditional measurement microphones. This paper shows that high-quality measurement microphones can be made using MEMS technology, with a superior noise performance.
  • Keywords
    acoustic intensity measurement; elemental semiconductors; environmental testing; finite element analysis; frequency response; micromachining; microphones; microsensors; semiconductor device noise; semiconductor device packaging; silicon; wafer bonding; MEMS fabrication; MEMS technology; Si; bulk micromachining; condenser type; environmental testing; finite element methods; frequency response; high-quality microphones; measurement microphone; micromachined microphone; noise level; packaging technology; sensitivity; silicon chip design; sound level measurement; static pressure variations; temperature changes; wafer bonding; Frequency measurement; Frequency response; Humidity measurement; Micromechanical devices; Microphones; Noise level; Noise measurement; Pressure measurement; Semiconductor device measurement; Vibration measurement;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2003.820260
  • Filename
    1257368