• DocumentCode
    855181
  • Title

    Application of subspace projection approaches for reduced-order modeling of electromagnetic systems

  • Author

    Zhou, Tingdong ; Dvorak, Steven L. ; Prince, John L.

  • Author_Institution
    Enterprise Syst. Group, IBM Corp., Poughkeepsie, NY, USA
  • Volume
    26
  • Issue
    4
  • fYear
    2003
  • Firstpage
    353
  • Lastpage
    360
  • Abstract
    Subspace projection approaches, including the Pade´ via Lanczos (PVL), Krylov, and rational Krylov algorithms, are used for reduced-order modeling of wide-band electromagnetic systems. The properties of these algorithms are discussed. A frequency segmentation technique has also been used with the Lanczos algorithm to obtain benchmark data of electromagnetic fields and for scattering parameter extraction from the calculated electromagnetic field values. From the various techniques, the combined PVL/frequency segmentation technique is the most promising for efficient and accurate modeling of electromagnetic systems.
  • Keywords
    Maxwell equations; S-parameters; computational electromagnetics; electromagnetic fields; finite difference methods; frequency-domain analysis; iterative methods; linear systems; matrix decomposition; rational functions; reduced order systems; state-space methods; waveguide discontinuities; waveguide theory; Maxwell´s curl equations; Pade approximations; Pade via Lanczos algorithm; dielectric discontinuity; electromagnetic discontinuity solver; electromagnetic fields; frequency domain finite difference method; frequency segmentation technique; parallel-plate waveguide; perfectly matched layers; rational Krylov algorithm; reduced-order modeling; scattering parameter; state-space representation; subspace projection approaches; wide-band electromagnetic system; Electromagnetic fields; Electromagnetic modeling; Frequency; Integrated circuit interconnections; Integrated circuit packaging; Linear systems; Power system interconnection; Power system modeling; Scattering parameters; Wideband;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2003.821072
  • Filename
    1257429