DocumentCode
855806
Title
Heat treatment effects of CoCr sputtered films
Author
Jang, Mung Woo ; Lee, Taek Dong ; Kim, Young Ho ; Kang, Tak
Author_Institution
Div. of Metals, Korea Inst. of Sci. & Technol., Seoul, South Korea
Volume
26
Issue
5
fYear
1990
fDate
9/1/1990 12:00:00 AM
Firstpage
1623
Lastpage
1625
Abstract
Thermomagnetic analyses of RF-sputtered Co84Cr16 and Co78Cr22 thin films are reported. It is found that, when CoCr film is heated lower than the HCP→FCC transformation temperature, M s drops substantially after holding at a constant temperature, and M s at room temperature decreases after one cycle of heat treatment. This is due to Cr redistribution from the Cr-rich region of the film. When CoCr is heated higher than the HCP→FCC transformation temperature, M s jumps sharply after holding at a constant temperature. This is due to the formation of an FCC phase with high M s at higher temperature. A study of the angular dependence of coercivity indicates that the demagnetization mechanism of as-sputtered film seems to be an incoherent rotation mechanism while for the heat-treated film it may be domain wall motion or another combined mechanism. The perpendicular anisotropy in the Cr film may be connected with the existence of a highly Cr segregated region as well as c -axis alignments
Keywords
chromium alloys; cobalt alloys; coercive force; crystal orientation; demagnetisation; magnetic anisotropy; magnetic domain walls; magnetic thin films; magnetisation; segregation; sputtered coatings; thermomagnetic treatment; CoCr sputtered films; Cr redistribution; Cr segregated region; HCP→FCC transformation temperature; angular dependence; c-axis alignments; coercivity; demagnetization mechanism; domain wall motion; heat treatment; incoherent rotation mechanism; magnetisation; perpendicular anisotropy; thermomagnetic analysis; Annealing; Chromium; Coercive force; Heat treatment; Heating; Magnetic analysis; Magnetic films; Sputtering; Substrates; Temperature;
fLanguage
English
Journal_Title
Magnetics, IEEE Transactions on
Publisher
ieee
ISSN
0018-9464
Type
jour
DOI
10.1109/20.104468
Filename
104468
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