DocumentCode
856693
Title
SWAN: high-level simulation methodology for digital substrate noise generation
Author
Badaroglu, Mustafa ; Van der Plas, Geert ; Wambacq, Piet ; Donnay, Stephane ; Gielen, G.E. ; De Man, Hugo J.
Author_Institution
IMEC, Leuven, Belgium
Volume
14
Issue
1
fYear
2006
Firstpage
23
Lastpage
33
Abstract
Substrate noise generated by the switching digital circuits degrades the performance of analog circuits embedded on the same substrate. It is therefore important to know the amount of noise at a certain point on the substrate. Existing transistor-level simulation approaches based on a substrate model extracted from layout information are not feasible for digital circuits of practical size. This paper presents a complete high-level methodology, which simulates a large digital standard cell-based design using a network of substrate macromodels, with one macromodel for each standard cell. Such macromodels can be constructed for both EPI-type and bulk-type substrates. Comparison of our substrate waveform analysis (SWAN) to several measurements and to several full SPICE simulations indicates that the substrate noise is simulated with our methodology within 10%-20% error in the time domain and within 2 dB relative error at the major resonance in the frequency domain. However, it is several orders of magnitude faster in CPU time than a full SPICE simulation.
Keywords
high level synthesis; integrated circuit modelling; integrated circuit noise; mixed analogue-digital integrated circuits; substrates; switching circuits; waveform analysis; EPI-type substrate; SPICE simulations; SWAN; analog circuits; bulk-type substrates; digital standard cell; digital substrate noise generation; frequency domain; ground bounce; high-level simulation; mixed analog-digital IC; substrate macromodels; substrate waveform analysis; switching digital circuits; time domain; Analog circuits; Analytical models; Circuit noise; Circuit simulation; Data mining; Degradation; Digital circuits; Noise generators; SPICE; Switching circuits; High-level simulation; ground bounce; macromodel; mixed analog–digital ICs; substrate noise;
fLanguage
English
Journal_Title
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher
ieee
ISSN
1063-8210
Type
jour
DOI
10.1109/TVLSI.2005.863191
Filename
1603565
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