Title :
Hybrid integration of RF MEMS multiport switches
Author :
Daneshmand, M. ; Mansour, R.R.
Keywords :
Assembly; Flip chip; Insertion loss; Isolation technology; Micromechanical devices; Radio frequency; Radiofrequency microelectromechanical systems; Silicon; Switches; Transmission line matrix methods;
Journal_Title :
Electrical and Computer Engineering, Canadian Journal of
DOI :
10.1109/CJECE.2006.259186
