Title :
Magneto-Electrodynamical Modeling and Design of a Microspeaker Used for Mobile Phones With Considerations of Diaphragm Corrugation and Air Closures
Author :
Chao, Paul C P ; Chiu, Chi-Wei ; Hsu-Pang, Yuan
Author_Institution :
Dept. of Electr. & Control Eng., Nat. Chiao Tung Univ., Hsinchu
fDate :
6/1/2007 12:00:00 AM
Abstract :
Recent design trends for modern mobile phones are evolving to be miniaturized and versatile sounds in quality. To these ends, a microspeaker with a corrugated diaphragm is employed to broaden the sound frequency range. Due to the fact that diaphragm corrugation and air closures were not considered in any past studies, this study presents comprehensive modeling with the consideration of diaphragm corrugations and air closures. It starts with the modeling on the subsystems of the voice coil motor (VCM) in the speaker. The magnetic field of the VCM is modeled by one set of finite elements, while the corrugated diaphragm is modeled by another set of finite elements. In addition, the air closures above or below the diaphragm are modeled by the third group of finite elements based on basic acoustics. Simulations are conducted with and without air closures. It is found that: 1) the speaker with 45deg corrugation exhibits overall higher (better) sound pressure levels (SPLs), while 2) the 75deg corrugation leads to unsatisfied, low SPLs below 1 kHz and two undesired antiresonances at higher frequencies. The theoretical findings are successfully validated by experiments
Keywords :
diaphragms; finite element analysis; micromotors; mobile handsets; air closures; corrugated diaphragm; diaphragm corrugation; finite element analysis; magnetoelectrodynamical modeling; microspeaker design; mobile phones; voice coil motors; Coils; Finite element methods; Frequency response; Loudspeakers; Magnetic analysis; Magnetic fields; Magnetic flux; Mathematical model; Micromotors; Mobile handsets; Air closure; cell phones; diaphragm corrugation; microspeakers; voice coil motor (VCM);
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2007.892871