• DocumentCode
    859047
  • Title

    Deep submicron CMOS technology enables system-on-chip for wireless communications ICs

  • Author

    Hammes, Markus ; Kranz, Christian ; Seippel, Dietolf

  • Author_Institution
    Infineon Technol., Neubiberg
  • Volume
    46
  • Issue
    9
  • fYear
    2008
  • fDate
    9/1/2008 12:00:00 AM
  • Firstpage
    154
  • Lastpage
    161
  • Abstract
    Deep submicron CMOS technologies enable sophisticated system-on-chip technologies, moving beyond traditional integration of digital functionality to include mixed-signal, RF, and power management capabilities. New levels of integration bring with them additional challenges that need to be addressed such as the cross-coupling of noise from digital switching circuits to sensitive analog/RF blocks, and the handling of high voltages by the PMU with decreasing maximum gate/drain-source voltages. This work describes SoC integration in local area wireless (e.g., Bluetooth) as well as in cellular applications (e.g., GSM).
  • Keywords
    CMOS integrated circuits; cellular radio; mixed analogue-digital integrated circuits; radiofrequency integrated circuits; system-on-chip; wireless LAN; CMOS technology; cellular communications; digital switching circuits; mixed signal integrated circuits; power management; system-on-chip; wireless LAN; CMOS technology; Circuit noise; Energy management; Noise level; Power system management; Radio frequency; System-on-a-chip; Technology management; Voltage; Wireless communication;
  • fLanguage
    English
  • Journal_Title
    Communications Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0163-6804
  • Type

    jour

  • DOI
    10.1109/MCOM.2008.4623721
  • Filename
    4623721