• DocumentCode
    860276
  • Title

    Engineering sidewall angles of silica-on-silicon waveguides

  • Author

    Ou, Haiyan

  • Author_Institution
    COM Center, Tech. Univ. of Denmark, Lyngby, Denmark
  • Volume
    40
  • Issue
    1
  • fYear
    2004
  • Firstpage
    27
  • Lastpage
    29
  • Abstract
    Burned photoresist is used as etch mask when producing silica-on-silicon waveguides. The sidewall angle of the optical glass waveguides is engineered by varying photoresist thickness and etch selectivity. The principle for the formation of the angles is introduced and very promising experimental results are shown.
  • Keywords
    optical fabrication; optical glass; optical planar waveguides; photoresists; plasma CVD; silicon; sputter etching; RIE; Si; SiO2-Si; burned photoresist etch mask; etch selectivity; hard baking; optical glass waveguides; planar waveguide technology; plasma enhanced chemical vapour deposition; sidewall angle engineering; silica-on-silicon waveguides; varying photoresist thickness;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20040005
  • Filename
    1260656
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=860276