Title :
Engineering sidewall angles of silica-on-silicon waveguides
Author_Institution :
COM Center, Tech. Univ. of Denmark, Lyngby, Denmark
Abstract :
Burned photoresist is used as etch mask when producing silica-on-silicon waveguides. The sidewall angle of the optical glass waveguides is engineered by varying photoresist thickness and etch selectivity. The principle for the formation of the angles is introduced and very promising experimental results are shown.
Keywords :
optical fabrication; optical glass; optical planar waveguides; photoresists; plasma CVD; silicon; sputter etching; RIE; Si; SiO2-Si; burned photoresist etch mask; etch selectivity; hard baking; optical glass waveguides; planar waveguide technology; plasma enhanced chemical vapour deposition; sidewall angle engineering; silica-on-silicon waveguides; varying photoresist thickness;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20040005
