• DocumentCode
    860670
  • Title

    Back-gated MOSFETs with controlled silicon thickness for adaptive threshold-voltage control

  • Author

    Avci, U. ; Tiwari, S.

  • Author_Institution
    Sch. of Appl. & Eng. Phys., Cornell Univ., Ithaca, NY, USA
  • Volume
    40
  • Issue
    1
  • fYear
    2004
  • Firstpage
    74
  • Lastpage
    75
  • Abstract
    Experimental results for back-gated thin silicon transistors that allow adaptive threshold-voltage control and exhibit low drain-induced-barrier-lowering due to improved electrostatics of the geometry are reported. The implementation of the back-gate is achieved by a low-temperature bonding process capable of tens of nanometre silicon channel thickness, good surface and bulk quality. The technology is compatible with mainstream silicon CMOS processing technology.
  • Keywords
    MOSFET; chemical mechanical polishing; isolation technology; oxidation; silicon-on-insulator; CMOS-compatible process; Si; adaptive threshold-voltage control; back-gated MOSFET; biased SOI devices; chemical mechanical polish; controlled silicon thickness; isolation oxidation recess; low drain-induced barrier-lowering; low-temperature bonding process; patterning; recessed-oxide depth;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20040028
  • Filename
    1260686