DocumentCode
860670
Title
Back-gated MOSFETs with controlled silicon thickness for adaptive threshold-voltage control
Author
Avci, U. ; Tiwari, S.
Author_Institution
Sch. of Appl. & Eng. Phys., Cornell Univ., Ithaca, NY, USA
Volume
40
Issue
1
fYear
2004
Firstpage
74
Lastpage
75
Abstract
Experimental results for back-gated thin silicon transistors that allow adaptive threshold-voltage control and exhibit low drain-induced-barrier-lowering due to improved electrostatics of the geometry are reported. The implementation of the back-gate is achieved by a low-temperature bonding process capable of tens of nanometre silicon channel thickness, good surface and bulk quality. The technology is compatible with mainstream silicon CMOS processing technology.
Keywords
MOSFET; chemical mechanical polishing; isolation technology; oxidation; silicon-on-insulator; CMOS-compatible process; Si; adaptive threshold-voltage control; back-gated MOSFET; biased SOI devices; chemical mechanical polish; controlled silicon thickness; isolation oxidation recess; low drain-induced barrier-lowering; low-temperature bonding process; patterning; recessed-oxide depth;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:20040028
Filename
1260686
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