DocumentCode :
860977
Title :
Comparison of time-to-failure of GeSi and Si bipolar transistors
Author :
Neugroschel, A. ; Sah, Chih-Tang ; Ford, J.M. ; Steele, J. ; Tang, R. ; Stein, C.
Author_Institution :
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
Volume :
17
Issue :
5
fYear :
1996
fDate :
5/1/1996 12:00:00 AM
Firstpage :
211
Lastpage :
213
Abstract :
The effects of Ge in the epitaxial-base on the reliability of Si/Ge/sub x/Si/sub 1-x//Si heterojunction bipolar transistors were investigated. The ten-year time-to-failure under emitter-base junction reverse-bias stress was measured at the designed operation voltage by the current-acceleration method and compared to that of Si bipolar junction transistors with no Ge (x=0). The investigation shows that the Ge incorporated by the reduced pressure chemical vapor deposition epitaxial technology to give the ramp-type Ge profile has no adverse effects on the transistor reliability.
Keywords :
Ge-Si alloys; bipolar transistors; doping profiles; elemental semiconductors; failure analysis; heterojunction bipolar transistors; life testing; semiconductor device reliability; semiconductor materials; silicon; vapour phase epitaxial growth; Si; Si BJT; Si-GeSi-Si; Si/Ge/sub x/Si/sub 1-x//Si HBT; bipolar junction transistors; chemical vapor deposition; current-acceleration method; emitter-base junction reverse-bias stress; epitaxial-base; heterojunction bipolar transistors; ramp-type Ge profile; reduced pressure CVD epitaxial technology; reliability test; time-to-failure; transistor reliability; Acceleration; Bipolar transistors; Circuits; Current measurement; Extrapolation; Germanium silicon alloys; Silicon germanium; Stress; Time measurement; Voltage;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.491832
Filename :
491832
Link To Document :
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