Shielded-Loop-Type Onchip Magnetic-Field Probe to Evaluate Radiated Emission From Thin-Film Noise Suppressor

Author

Yamaguchi, Masahiro ; Koya, Shota ; Torizuka, Hideki ; Aoyama, Satoshi ; Kawahito, Shoji

Author_Institution

Graduate Sch. of Eng., Tohoku Univ., Sendai

Volume

43

Issue

6

fYear

2007

fDate

6/1/2007 12:00:00 AM

Firstpage

2370

Lastpage

2372

Abstract

A silicon integrated RF magnetic field probe has been designed and microfabricated using CMOS-silicon-on-insulator (SOI) technology with a 0.15-mum design rule on a high-resistivity silicon substrate. The size of the coil window was 180times180 mum². Coil and electrodes were separated by a 530-mum-long stripline so as to avoid stray voltage induction at the electrode portion. This probe was applied to evaluate the radiated emission from a thin-film electromagnetic noise suppressor. It was clarified and shown that the field intensity was suppressed by 4.0 dB at the center of the signal line at 1 GHz

Keywords

CMOS analogue integrated circuits; coils; electromagnetic devices; elemental semiconductors; integrated circuit design; integrated circuit technology; magnetic field measurement; microelectrodes; microstrip lines; probes; radiofrequency integrated circuits; radiofrequency interference; silicon; silicon-on-insulator; 0.15-mum design rule; 1 GHz; 180 mum; 530 mum; CMOS-silicon-on-insulator technology; SOI technology; Si; coil window; electrodes; electromagnetic radiative interference; high-resistivity silicon substrate; microfabrication; radiated emission; radiofrequency magnetic field probe; shielded-loop-type onchip magnetic-field probe; silicon integrated RF magnetic field probe; striplines; thin-film electromagnetic noise suppressor; CMOS technology; Coils; Electrodes; Magnetic films; Magnetic noise; Magnetic separation; Magnetic shielding; Probes; Radio frequency; Silicon; Amorphous magnetic films; complementary metal–oxide semiconductor (CMOS) analog integrated circuits (ICs); electromagnetic radiative interference; magnetic resonance; magnetic-field measurement; packaging;

fLanguage

English

Journal_Title

Magnetics, IEEE Transactions on

Publisher

ieee

ISSN

0018-9464

Type

jour

DOI

10.1109/TMAG.2007.892998

Filename

4202974