Modification of step-edge grain boundary Josephson junctions by electromigration

Author

Bulman, J.B. ; Murduck, J.M.

Author_Institution

Loyola Marymount Univ., Los Angeles, CA, USA

Volume

5

Issue

2

fYear

1995

fDate

6/1/1995 12:00:00 AM

Firstpage

2813

Lastpage

2815

Abstract

We report on the effects of large electric currents (>2 MA/cm/sup 2/) applied at /spl sim/300 K to step-edge thin-film microbridges of YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta//. These step-edge Josephson junctions showed an increase in their critical current (I/sub c/) after application of electromigration current, I/sub EM/. This increase of I/sub c/ was a permanent phenomenon. Electromigration was also performed on SNS YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta// thin-film microbridges and an increase in critical current was observed.<>

Keywords

Josephson effect; barium compounds; critical currents; electromigration; grain boundaries; high-temperature superconductors; superconducting device testing; superconducting microbridges; yttrium compounds; 300 K; 77 K; LaAlO/sub 3/; SNS thin-film microbridges; YBa/sub 2/Cu/sub 3/O/sub 7-/spl delta//; YBa/sub 2/Cu/sub 3/O/sub 7/; critical current; electromigration current; junction fabrication; large electric currents; step-edge grain boundary Josephson junctions; step-edge thin-film microbridges; Critical current; Dielectric substrates; Electrodes; Electromigration; High temperature superconductors; Josephson junctions; Pulsed laser deposition; Superconducting thin films; Thin film circuits; Transistors;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.403176

Filename

403176