A Benchtop System to Assess Cortical Neural Interface Micromechanics

Author

Das, R. ; Gandhi, D. ; Krishnan, S. ; Saggere, L. ; Rousche, P.J.

Author_Institution

Dept. of Bioeng., Illinois Univ., Chicago, IL

Volume

54

Issue

6

fYear

2007

fDate

6/1/2007 12:00:00 AM

Firstpage

1089

Lastpage

1096

Abstract

A benchtop brain tissue-microelectrode insertion model system was developed to aid in improving the design of cortical neural interfaces. The model partially mimics the in vivo environment via the use of human cadaver brain specimens (nspecimen=6), or agar gel exposed to physiologically relevant mechanical oscillations. 150 mum diameter stainless-steel microelectrode wires (TS=600 MPa) implanted 3.0 cm within fixed human primary auditory cortex (ntrial>10) experienced 133plusmn8 and 64plusmn4 mN of peak and steady axial forces. When subjected to a 3 Hz, 3-mm vertical oscillation, dynamic force amplitudes (n_trial>10) of 148plusmn10 mN were measured. The model system allows the study and comparison of static and dynamic forces and their mechanical influences on proposed implanted microelectrode structures

Keywords

bioMEMS; brain; microelectrodes; neurophysiology; prosthetics; 150 mum; 3.0 cm; agar gel; axial force; benchtop brain tissue-microelectrode insertion model system; cortical neural interface micromechanics; dynamic forces; fixed human primary auditory cortex; human cadaver brain specimens; implant; mechanical oscillations; stainless-steel microelectrode wires; static forces; vertical oscillation; Biomedical engineering; Brain modeling; Electrodes; Force measurement; Humans; Implants; Microelectrodes; Neural engineering; Neural prosthesis; Prosthetics; Brain oscillations; implant micromechanics; neural prosthetic systems; sensory prostheses; Biomechanics; Biomimetics; Cadaver; Cerebral Cortex; Elasticity; Electrodes, Implanted; Equipment Design; Equipment Failure Analysis; Humans; Stress, Mechanical; Tissue Culture Techniques; Viscosity;

fLanguage

English

Journal_Title

Biomedical Engineering, IEEE Transactions on

Publisher

ieee

ISSN

0018-9294

Type

jour

DOI

10.1109/TBME.2007.897139

Filename

4203011