DocumentCode :
86272
Title :
An Analysis of Conductor Surface Roughness Effects on Signal Propagation for Stripline Interconnects
Author :
Xichen Guo ; Jackson, David R. ; Koledintseva, Marina Y. ; Hinaga, Scott ; Drewniak, James L. ; Ji Chen
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Houston, Houston, TX, USA
Volume :
56
Issue :
3
fYear :
2014
fDate :
Jun-14
Firstpage :
707
Lastpage :
714
Abstract :
Conductors with a roughened surface have significant effects on high-speed signal propagation on backplane traces designed for a 10+ Gb/s network. An accurate approach to evaluate these effects, including the signal attenuation and the phase delay, is proposed in this paper. A differential extrapolation roughness measurement technique is first used to extract the dielectric properties of the substrate used for lamination, and then a periodic model is used to calculate an equivalent roughened conductor surface impedance, which is then used to modify the transmission line per-unit-length parameters R and L. The results indicate that the conductor surface roughness increases the conductor loss significantly as well as noticeably increasing the effective dielectric constant. This approach is validated using both a full-wave simulation tool and measurements, and is shown to be able to provide robust results for the attenuation constant within ±0.2 Np/m up to 20 GHz.
Keywords :
delays; dielectric properties; electromagnetic wave scattering; interconnections; printed circuits; strip line discontinuities; surface roughness; conductor surface roughness effect; dielectric property extraction; differential extrapolation roughness measurement technique; equivalent roughened conductor surface impedance; high speed signal propagation; phase delay; signal attenuation; stripline interconnect; Conductors; Impedance; Rough surfaces; Stripline; Surface impedance; Surface roughness; Surface waves; Floquet waves; full-wave; periodic structure; roughness measurement; surface roughness;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2013.2294958
Filename :
6730684
Link To Document :
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