Integration of step-edge grain boundary Josephson junctions with YBCO multilayers for electronics applications

Author

Daly, K.P. ; Murduck, J.M. ; Pettiett-Hall, C.L. ; Sergant, M.

Author_Institution

Electron. Syst. & Technol. Div., TRW Inc., Redondo Beach, CA, USA

Volume

5

Issue

2

fYear

1995

fDate

6/1/1995 12:00:00 AM

Firstpage

3131

Lastpage

3134

Abstract

We discuss our multilayer YBCO process which uses step-edge junctions. Key issues are dielectric defect density, wiring layer critical current over edges of underlying features and junction critical current uniformity. We have demonstrated an average defect density of about 450/cm/sup 2/ over many wafers. Wiring critical current exceeds 1 mA//spl mu/m of line width. We have demonstrated SQUIDs at 77 K using this process.<>

Keywords

Josephson effect; SQUIDs; barium compounds; critical current density (superconductivity); grain boundaries; high-temperature superconductors; superconducting thin films; yttrium compounds; 77 K; HTS layers; HTSC; Josephson junctions; SQUIDs; YBCO multilayers; YBaCuO; dielectric defect density; electronics applications; junction critical current uniformity; multilayer YBCO process; step-edge grain boundary junctions; wiring layer critical current; Argon; Critical current; Dielectric substrates; High temperature superconductors; Josephson junctions; Nonhomogeneous media; Pulsed laser deposition; SQUIDs; Wiring; Yttrium barium copper oxide;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.403255

Filename

403255