DocumentCode
863129
Title
Monte Carlo modeling of electron transport in repeated overshoot structures
Author
Crandle, Timothy L. ; East, Jack R. ; Blakey, Peter A.
Author_Institution
Microelectron. & Comput. Technol. Corp., Austin, TX, USA
Volume
36
Issue
2
fYear
1989
fDate
2/1/1989 12:00:00 AM
Firstpage
300
Lastpage
308
Abstract
Repeated velocity overshoot has been proposed as a way of obtaining high average velocities over significant distances in semiconductor devices. The potential of this concept is examined using a fully-self-consistent particle-field Monte Carlo simulation. Numerical results are presented for realistic periodic overshoot structures for a range of bias conditions and operating temperatures of 77 and 300 K. Local velocity overshoot peaks are observed in the simulated structures, but the average carrier velocity and current at each bias point are in all cases less than those associated with transport in bulk material at the same bias point. The physical mechanisms underlying this result are analyzed. It is found that ensemble (diffusion) effects, which were neglected in the original proposal of the repeated overshoot concept, strongly influence the results that are achievable in practice
Keywords
Monte Carlo methods; electronic conduction in crystalline semiconductor thin films; semiconductor junctions; 300 K; 77 K; Monte Carlo modeling of electron transport; average carrier velocity; bandgap engineering; bias conditions; fully-self-consistent particle-field Monte Carlo simulation; obtaining high average velocities; operating temperatures; physical mechanisms; realistic periodic overshoot structures; repeated overshoot structures; semiconductor devices; simulated structures; velocity overshoot peaks; Conductors; Electrons; Heterojunctions; Microelectronics; Monte Carlo methods; Periodic structures; Proposals; Semiconductor devices; Semiconductor superlattices; Temperature distribution;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.19929
Filename
19929
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