• DocumentCode
    863451
  • Title

    Multilayer Josephson junction flux quantum devices

  • Author

    Lomatch, S. ; Rippert, E.D. ; Ketterson, J.B.

  • Author_Institution
    Dept. of Phys. & Astron., Northwestern Univ., Evanston, IL, USA
  • Volume
    5
  • Issue
    2
  • fYear
    1995
  • fDate
    6/1/1995 12:00:00 AM
  • Firstpage
    3147
  • Lastpage
    3151
  • Abstract
    We describe the properties of flux quantum circuitry employing the relatively young technology of multilayer Josephson junctions with n superconductor-insulator (SI) layers. Multilayer junctions can be employed as both passive and active devices to increase circuit integration density, allow for new logic/voltage thresholds and higher impedances, and improve thermal noise stability. We present the results from numerical simulations of a conventional RSFQ circuit and two novel circuits with multilayer junction designs. Neural circuitry is a focus of our novel multilayer designs. We also discuss layout and fabrication issues, considering the recent progress in the fabrication of Nb multilayer junctions with AlN tunnel barriers, which exhibit intrinsic overdamping at the level of each SI layer. Included in this discussion is a long term assessment of a multilayer approach in view of deep sub-micron and high T/sub c/ technologies.<>
  • Keywords
    Josephson effect; neural chips; superconducting device noise; superconducting integrated circuits; superconducting logic circuits; thermal noise; Nb-AlN; RSFQ circuit; circuit integration density; fabrication issues; flux quantum circuitry; intrinsic overdamping; logic/voltage thresholds; multilayer Josephson junctions; neural circuitry; rapid single flux quantum circuit; superconductor-insulator layers; thermal noise stability; Fabrication; Impedance; Josephson junctions; Logic circuits; Logic devices; Nonhomogeneous media; Superconducting device noise; Superconducting epitaxial layers; Superconducting logic circuits; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.403259
  • Filename
    403259