DocumentCode :
863670
Title :
Microstructure and magnetic properties of thin-film Co-Ni-Pt for longitudinal recording
Author :
Mahvan, N. ; Zeltser, A.M. ; Lambeth, D.N. ; Laughlin, D.E. ; Kryder, M.H.
Author_Institution :
Carnegie-Mellon Univ., Pittsburgh, PA, USA
Volume :
26
Issue :
5
fYear :
1990
fDate :
9/1/1990 12:00:00 AM
Firstpage :
2277
Lastpage :
2279
Abstract :
The dependence of microstructure and magnetic properties of RF-sputtered thin films of Co-Ni-Pt deposited on NiP/Al and Cr/NiP/Al substrates was studied as a function of platinum composition, Ar pressure, and sputtering power. Transmission electron microscopy and electron and X-ray diffraction were utilized to determine the correlation between the observed coercivity, remanence squareness behavior, and microstructure. It has been found that in the case of films on NiP/Al substrates, the coercivity is controlled by the grain size, whereas it is dominated by the relative amount of the HCP and FCC cobalt phases for the films deposited on a 300-nm Cr underlayer. An increase in the Ar pressure leads to a further increase in coercivity for both substrates. This behavior was attributed to an increase in the grain size and a more favorable c-axis orientation of the HCP cobalt phase for Cr and NiP underlayers, respectively
Keywords :
cobalt alloys; coercive force; crystal atomic structure of alloys; ferromagnetic properties of substances; magnetic tapes; magnetic thin films; nickel alloys; platinum alloys; sputtered coatings; CoNiPt-Cr-NiP-Al; CoNiPt-NiP-Al; Cr-NiP-Al substrate; NiP-Al substrate; RF-sputtered thin films; TEM analysis; X-ray diffraction; coercivity; grain size; magnetic properties; microstructure; remanence squareness behavior; sputtering power; Argon; Chromium; Coercive force; Electrons; Grain size; Magnetic films; Magnetic properties; Microstructure; Sputtering; Substrates;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/20.104696
Filename :
104696
Link To Document :
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