• DocumentCode
    864016
  • Title

    DNA-templated copper nanowire fabrication by a two-step process involving electroless metallization

  • Author

    Kudo, Hidetoshi ; Fujihira, Masamichi

  • Author_Institution
    Dept. of Biomolecular Eng., Tokyo Inst. of Technol., Yokohama
  • Volume
    5
  • Issue
    2
  • fYear
    2006
  • fDate
    3/1/2006 12:00:00 AM
  • Firstpage
    90
  • Lastpage
    92
  • Abstract
    Here, we report a new fabrication method of DNA-templated copper nanowires. The copper nanowires were fabricated via two-step reactions. First, Pd(II) ions were electrostatically adsorbed onto negatively charged DNA molecules immobilized on the substrate surfaces and reduced chemically. As a result, palladium nanowires with a diameter of approximately 6 nm were obtained. Second, the palladium nanowires were dipped into a copper electroless plating bath. Electroless deposition of copper proceeded specifically on the palladium nanowires. The diameters of the copper nanowires were controlled by the plating time
  • Keywords
    DNA; adsorption; copper; electroless deposition; metallisation; molecular biophysics; nanotechnology; nanowires; palladium; Cu; DNA-templated copper nanowire fabrication; Pd; copper electroless plating bath; electroless deposition; electroless metallization; electrostatic adsorption; nanotechnology; palladium ions; palladium nanowires; substrate surfaces; two-step reaction; Chemicals; Copper; DNA; Fabrication; Glass; Lithography; Metallization; Nanotechnology; Palladium; Tellurium; Copper; DNA; nanotechnology; palladium;
  • fLanguage
    English
  • Journal_Title
    Nanotechnology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1536-125X
  • Type

    jour

  • DOI
    10.1109/TNANO.2006.869691
  • Filename
    1605219