DocumentCode
864457
Title
Temperature-aware computer systems: Opportunities and challenges
Author
Skadron, Kevin ; Stan, Mircea R. ; Huang, Wei ; Velusamy, Sivakumar ; Sankaranarayanan, Karthik ; Tarjan, David
Author_Institution
Virginia Univ., Charlottesville, VA, USA
Volume
23
Issue
6
fYear
2003
Firstpage
52
Lastpage
61
Abstract
Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. The authors define the role of architecture techniques and describe hotspot, an accurate yet fast thermal model suitable for computer architecture research.
Keywords
computer architecture; thermal management (packaging); computer architecture; temperature-aware computer systems; thermal model; Clocks; Computer architecture; Costs; Heating; Microarchitecture; Microprocessors; Packaging; Temperature; Thermal management; Thermal stresses;
fLanguage
English
Journal_Title
Micro, IEEE
Publisher
ieee
ISSN
0272-1732
Type
jour
DOI
10.1109/MM.2003.1261387
Filename
1261387
Link To Document