• DocumentCode
    864457
  • Title

    Temperature-aware computer systems: Opportunities and challenges

  • Author

    Skadron, Kevin ; Stan, Mircea R. ; Huang, Wei ; Velusamy, Sivakumar ; Sankaranarayanan, Karthik ; Tarjan, David

  • Author_Institution
    Virginia Univ., Charlottesville, VA, USA
  • Volume
    23
  • Issue
    6
  • fYear
    2003
  • Firstpage
    52
  • Lastpage
    61
  • Abstract
    Temperature-aware design techniques have an important role to play in addition to traditional techniques like power-aware design and package- and board-level thermal engineering. The authors define the role of architecture techniques and describe hotspot, an accurate yet fast thermal model suitable for computer architecture research.
  • Keywords
    computer architecture; thermal management (packaging); computer architecture; temperature-aware computer systems; thermal model; Clocks; Computer architecture; Costs; Heating; Microarchitecture; Microprocessors; Packaging; Temperature; Thermal management; Thermal stresses;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.2003.1261387
  • Filename
    1261387