• DocumentCode
    864539
  • Title

    Demonstration of Latency Reduction in Ultra-Short Distance Interconnections Using Optical Fanout

  • Author

    Pappu, Anand M. ; Apsel, Alyssa B.

  • Author_Institution
    Cornell Univ., Ithaca, NY
  • Volume
    12
  • Issue
    6
  • fYear
    2006
  • Firstpage
    1664
  • Lastpage
    1670
  • Abstract
    In this paper, we present a hybrid optoelectronic system capable of improving the performance of short-distance broadcast architectures such as arrays of gates, cells, or processors. By incorporating a layer of the optical fanout in the electrical fanout link, we utilize the "electrical isolation" advantage of the optical interconnects in addition to the absence of the parasitics. Our proof-of-concept circuits show improved signal latency even for a small electrical fanout to 32 minimum-sized inverters, corresponding to an electrical link length of 200mum in a 0.25-mum technology. This is the first physical demonstration of the advantages of using optics in silicon very large scale integrated (VLSI) systems at these distances. We also demonstrate an advantage in the energy-delay-squared product for fanout to more than 250 minimum-sized inverters corresponding to a distance of 1.5 mm
  • Keywords
    integrated optics; integrated optoelectronics; micro-optics; optical interconnections; 0.25 mum; 1.5 mm; 200 mum; broadcast architectures; electrical fanout link; electrical isolation; hybrid optoelectronic system; latency reduction; minimum-sized inverters; optical fanout; optical interconnects; signal latency; ultrashort distance interconnections; very large scale integrated systems; Broadcasting; Delay; Integrated circuit interconnections; Integrated circuit technology; Integrated optics; Inverters; Isolation technology; Optical interconnections; Silicon; Very large scale integration; Interconnects; optoelectronics; short-distance optoelectronic links; silicon micro-photonics;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/JSTQE.2006.884414
  • Filename
    4032685