• DocumentCode
    864669
  • Title

    Modelling on-chip circular double-spiral stacked inductors for RFICs

  • Author

    Yin, W.Y. ; Pan, S.J. ; Li, L.W. ; Gan, Y.B.

  • Author_Institution
    Temasek Labs., Nat. Univ. of Singapore, Singapore
  • Volume
    150
  • Issue
    6
  • fYear
    2003
  • fDate
    12/1/2003 12:00:00 AM
  • Firstpage
    463
  • Lastpage
    469
  • Abstract
    Extensive experimental results and detailed investigations of the performance of on-chip circular double-spiral stacked inductors on silicon substrates are presented. Based on a proposed equivalent circuit model and measured S-parameters using the de-embedding technique, the inductance, L, resonant frequency, fres, Q-factor, coupling capacitance between the upper and lower spirals, and oxide capacitance of these inductors are extracted and compared with the single-spiral case. Some locally scalable formulas, including single-spiral geometries, are obtained to predict inductor performance. Methods to improve the L and Q-factor are explored for double-spiral stacked inductors with single via connection.
  • Keywords
    Q-factor; S-parameters; capacitance; electromagnetic coupling; equivalent circuits; inductance; inductors; radiofrequency integrated circuits; silicon; substrates; Q-factor; RFIC; S-parameters; Si; circular double-spiral inductors; circular double-spiral stacked inductors; coupling capacitance; equivalent circuit; inductance; on-chip stacked inductors; oxide capacitance; resonant frequency; silicon substrates; single-spiral inductors; via connection;
  • fLanguage
    English
  • Journal_Title
    Microwaves, Antennas and Propagation, IEE Proceedings
  • Publisher
    iet
  • ISSN
    1350-2417
  • Type

    jour

  • DOI
    10.1049/ip-map:20030854
  • Filename
    1261683