DocumentCode
864763
Title
Guest editorial special issue on interface reliability
Author
Blish, R. ; Christou, Alex ; Thomas, Robert ; Samuelson, G.
Author_Institution
Advanced Microdevices Technology Development Group
Volume
3
Issue
4
fYear
2003
Firstpage
110
Lastpage
110
Keywords
Adhesives; Composite materials; Copper; Materials reliability; Materials science and technology; Mechanical factors; Metals industry; Polyimides; Semiconductor device modeling; USA Councils;
fLanguage
English
Journal_Title
Device and Materials Reliability, IEEE Transactions on
Publisher
ieee
ISSN
1530-4388
Type
jour
DOI
10.1109/TDMR.2003.822338
Filename
1261723
Link To Document