Photomask–photoresist techniques for cryotron fabrication

Thin film superconductors will find significant applications as computer components only if their potential for economical high density integration in a single unit of manufacture becomes a reality. This paper will describe a fabrication process based on the use of photomask-photoresist techniques to form multilayered devices which meet these requirements. This process is compared with that formerly used, based on mask stencil techniques, to illustrate the significance of this development with respect to 1) cryotron device densities, 2) process complexity, 3) electrical and structural characteristics of devices, and 4) circuit design considerations. The major advances made as a result of this process innovation are related to prospects for significant computer component applications.