Title :
E-beam direct wafer writing process using a water-soluble conductive layer
Author :
Watanabe, Hisashi ; Todokoro, Yoshihiro
Author_Institution :
Matushita Electron. Corp., Kyoto, Japan
fDate :
3/1/1989 12:00:00 AM
Abstract :
The water-soluble conductive layer(WSCL) is ammonium poly (p-styrene sulfonate) having ionic conductivity and water solubility. The process consists of applying thin WSCL to the e-beam resist surface prior to the conventional exposure step. WSCL is subsequently removed and the e-beam resist developed in the ordinary way. The process has general utility for various resists, eliminating charging effects caused by -beam exposure
Keywords :
VLSI; electron beam lithography; polymer films; E-beam direct wafer writing process; WSCL; ammonium poly (p-styrene sulfonate; e-beam resist surface; eliminating charging effects; ionic conductivity; water-soluble conductive layer; Application specific integrated circuits; Electrical resistance measurement; Fabrication; Lithography; Nonhomogeneous media; Resists; Semiconductor films; Silicon; Surface charging; Writing;
Journal_Title :
Electron Devices, IEEE Transactions on
