DocumentCode
866143
Title
Si-gate CMOS devices on a Si lateral solid-phase epitaxial layer
Author
Hirashita, Norio ; Katoh, Teruo ; Onoda, Hiroshi
Author_Institution
Oki Electr. Ind. Co. Ltd., Tokyo, Japan
Volume
36
Issue
3
fYear
1989
fDate
3/1/1989 12:00:00 AM
Firstpage
548
Lastpage
552
Abstract
Si-gate CMOS devices fabricated on a lateral solid-phase epitaxial Si layer grown from vacuum-deposited amorphous Si over SiO2 patterns are discussed. Electrical characteristics are examined and correlated with microstructural characteristics of the layer by performing transmission electron microscopy on actual transistors. The layer can be divided into three regions. Carrier mobilities obtained from each region are discussed in terms of the crystalline quality. The maximum obtained field-effect mobilities are 570 cm2/V-s and 160 cm2/V-s for n-channel and p-channel transistors, respectively. The SMOS inverter chain with 100 stages and a channel length of 1.5 μm has a delay time of 310 ps per gate. These results indicate that the lateral solid-phase epitaxy has potential for the fabrication of high-speed silicon-on-insulator devices
Keywords
CMOS integrated circuits; elemental semiconductors; integrated circuit technology; semiconductor epitaxial layers; semiconductor technology; semiconductor-insulator boundaries; silicon; solid phase epitaxial growth; 1.5 micron; 310 ps; SMOS inverter chain; SOI devices; Si lateral solid-phase epitaxial layer; Si-SiO2; Si-gate CMOS devices; channel length; crystalline quality; field-effect mobilities; lateral solid-phase epitaxy; microstructural characteristics; n-channel transistors; p-channel transistors; transmission electron microscopy; Amorphous materials; Crystal microstructure; Crystallization; Delay effects; Electric variables; Epitaxial growth; Epitaxial layers; FETs; Inverters; Transmission electron microscopy;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.19967
Filename
19967
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