DocumentCode
866677
Title
As Migration during PtSi Formation
Author
Hamdi, A.H. ; McDaniel, F.D. ; Wilson, S.R.
Author_Institution
Department of Physics North Texas State University Denton, TX 76203
Volume
30
Issue
2
fYear
1983
fDate
4/1/1983 12:00:00 AM
Firstpage
1738
Lastpage
1740
Abstract
The migration of implanted As durinq PtSi formation on (100) Si wafers has been studied by Rutherford backscattering techniques. Two thicknesses of PtSi layer (50 and 200 nm) have been choosen for this study. The PtSi formation temperatures were either 525°C or 625°C. The data show that the number of the migrating As atoms is independent of the PtSi thickness or formation temperatures used in this investigation.
Keywords
Annealing; Atmosphere; Atomic layer deposition; Backscatter; Etching; Magnetic analysis; Physics; Silicides; Silicon; Temperature;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.1983.4332628
Filename
4332628
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