Systematic procedures for digital system realization from logic design to production

A simple, systematic procedure is presented for converting Integrated Circuit Packages (ICP´s) and logical designs, first to test breadboards and prototypes and later through ascending packaging compatibility to production models. Emphasis is placed on a minimum number of human decisions, rapid design turnaround time, and available techniques using minimum cost capital equipment. The basic procedure produces two-layer printed circuit boards. A simple extension allows direct conversion to a high density multi-layer system.