• DocumentCode
    866724
  • Title

    Three-dimensional interconnect analysis using partial element equivalent circuits

  • Author

    Heeb, Hansruedi ; Ruehli, Albert E.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
  • Volume
    39
  • Issue
    11
  • fYear
    1992
  • fDate
    11/1/1992 12:00:00 AM
  • Firstpage
    974
  • Lastpage
    982
  • Abstract
    Two extensions to the partial element equivalent circuit (PEEC) approach for interconnect modeling are presented. First, retardation, the effect of the finite speed of electromagnetic interactions, is included. Second, PEEC is extended to include a circuit model of finite-size homogeneous dielectrics. It is shown that the retarded PEEC formulation with the new dielectric model is equivalent to a full-wave solution of Maxwell´s equation. Since they can be combined with linear and nonlinear circuits, the resulting models are more flexible than existing full-wave solvers
  • Keywords
    distributed parameter networks; equivalent circuits; linear network analysis; packaging; 3D interconnect modelling; circuit model; electromagnetic interactions; finite-size homogeneous dielectrics; interconnect analysis; partial element equivalent circuits; Capacitance; Distributed parameter circuits; Equivalent circuits; Finite difference methods; Frequency domain analysis; Integrated circuit interconnections; Maxwell equations; RLC circuits; Time domain analysis; Wires;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems I: Fundamental Theory and Applications, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1057-7122
  • Type

    jour

  • DOI
    10.1109/81.199878
  • Filename
    199878