• DocumentCode
    866741
  • Title

    Evolution of the concept of a computer on a slice

  • Author

    Sack, E.A. ; Lyman, R.C. ; Chang, G.Y.

  • Author_Institution
    Westinghouse Electric Corp., Elkridge, MD, USA
  • Volume
    52
  • Issue
    12
  • fYear
    1964
  • Firstpage
    1713
  • Lastpage
    1720
  • Abstract
    Techniques have been developed for the interconnection of a large number of gates on an integrated-circuit wafer to achieve multiple-bit logic functions on a single slice of silicon. An analysis of popular logic types indicates that the transistor-transistor-logic (TTL) circuit is well suited for use in such arrays. The output of two representative production lines has been shown to provide an economic yield for arrays of 10 to 30 gates on each chip. Experimental results are presented for logic-array designs involving the interconnection of 47 and 108 gates on the wafer. Packaging, rather than yield, appears to be the remaining challenge in the develepment of the concept. Ultimately, the achievement of a significant portion of a computer arithmetic function on a single wafer appears entirely feasible.
  • Keywords
    Digital arithmetic; Integrated circuit interconnections; Integrated circuit reliability; Integrated circuit yield; Logic arrays; Logic circuits; Logic functions; Packaging; Pins; Silicon;
  • fLanguage
    English
  • Journal_Title
    Proceedings of the IEEE
  • Publisher
    ieee
  • ISSN
    0018-9219
  • Type

    jour

  • DOI
    10.1109/PROC.1964.3472
  • Filename
    1445402