Title :
Electromagnetic deposition in an anatomically based model of man for leakage fields of a parallel-plate dielectric heater
Author :
Chen, Jin-Yuan ; Gandhi, Om P.
Author_Institution :
Dept. of Electr. Eng., Utah Univ., Salt Lake City, UT, USA
fDate :
1/1/1989 12:00:00 AM
Abstract :
An anatomically based 5628-cell model of a human being was used to calculate local, layer-averaged, and whole-body-averaged specific absorption rates and internal RF currents at 27.12 and 40.68 MHz for spatially variable electromagnetic fields of a parallel-plate applicator representative of RF dielectric heaters used in industry. The conditions of exposure of the man model considered are: isolated from ground, shoe-wearing condition, feet in contact with ground, and an additional grounded top plate 13.1 cm above the head to simulate screen rooms that are occasionally used for RF heaters. Since peak E fields as high as 1000-2700 V/m have been measured at locations typically occupied by the operator, significant internal RF currents on the order of 0.5-2.3 A are projected for the operators. Measurements of the foot currents at 27.12 and 40.68 MHz for a human subject are in reasonable agreement with the calculated values for the various conditions of exposure
Keywords :
biological effects of fields; dielectric heating; electric field effects; electromagnetic fields; physiological models; radiofrequency heating; 0.5 to 2.3 A; 27.12 MHz; 40.68 MHz; EM deposition; RF dielectric heaters; anatomically based model; applicator; cellular man model; human being; internal RF currents; layer-averaged SAR; leakage fields; local SAR; parallel-plate dielectric heater; physiological models; spatially variable electromagnetic fields; specific absorption rates; whole-body-averaged SAR; Applicators; Biological system modeling; Dielectric measurements; Electromagnetic fields; Electromagnetic heating; Electromagnetic modeling; Finite difference methods; Humans; Magnetic field measurement; Radio frequency;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on