• DocumentCode
    868187
  • Title

    Reliability and product integrity

  • Author

    Gollomp, Bernie

  • Volume
    5
  • Issue
    4
  • fYear
    2002
  • Firstpage
    61
  • Lastpage
    62
  • Keywords
    Assembly; Defense industry; Integrated circuit interconnections; Joining processes; Maintenance; Manufacturing industries; Material properties; Reliability engineering; Testing; Wire;
  • fLanguage
    English
  • Journal_Title
    Instrumentation & Measurement Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    1094-6969
  • Type

    jour

  • DOI
    10.1109/MIM.2002.1048984
  • Filename
    1048984