Title :
Numerical and Experimental Analysis of Nanosecond Pulse Dielectric Barrier Discharge-Induced Nonthermal Plasma for Pollution Control
Author :
Okubo, Masaaki ; Yoshida, Keiichiro ; Yamamoto, Toshiaki
Author_Institution :
Dept. of Mech. Eng., Osaka Prefecture Univ., Sakai
Abstract :
Numerical and experimental analyses are conducted on a nanosecond pulse dielectric barrier discharge-induced nonthermal plasma (NTP) for pollution control. In the numerical analysis, a commercial simulation software, CFD-ACE + solver, is used. The result indicates that a streamer progressing from the positive electrode to the grounded one is well simulated. At the end of the pulse, the electron temperature and electron number density in the coaxial-type plasma reactor finally reach approximately 1.7 eV and 1015 m-3, respectively. The radial electric field is almost constant in the plasma region. During the single pulse, the peak concentration of ozone is approximately 40 ppm near the surface of the glass barrier. Next, an experimental analysis on the optical emission spectra of the NTP is carried out. In the result, the second positive bands spectra of N2 are observed. The evaluated electron temperature is almost constant (approximately 1.8 eV), irrespective of frequency, discharge power, and radial position. This value and tendency agree well with the numerical results.
Keywords :
discharges (electric); numerical analysis; pollution control; electron temperature; emission spectroscopy; nanosecond pulse dielectric barrier discharge-induced nonthermal plasma; numerical analysis; optical emission spectra; pollution control; pulse corona discharge; Analytical models; Dielectrics; Electrodes; Electrons; Numerical analysis; Plasma applications; Plasma density; Plasma simulation; Plasma temperature; Pollution control; Dielectric barrier discharge; electron temperature; emission spectroscopy; nonthermal plasma (NTP); numerical analysis; pollution control; pulse corona discharge; streamer;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2008.2002217