• DocumentCode
    86918
  • Title

    Chua´s Constitutive Memristor Relations for Physical Phenomena at Metal–Oxide Interfaces

  • Author

    Orlowski, Marius ; Secco, Jacopo ; Corinto, Fernando

  • Author_Institution
    Dept. of Electron. Eng., Virginia Tech, Blacksburg, VA, USA
  • Volume
    5
  • Issue
    2
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    143
  • Lastpage
    152
  • Abstract
    Despite a considerable number of memristor models of different complexity proposed in the literature, there is an ongoing debate over what kind of memristor model should be universally adopted for exploration of the unique opportunities integrated memristor circuits may offer. Here, we follow Chua´s approach, that models for i-v characteristics are devoid of predictive power and that instead a memristor model should be expressed in terms of electric flux φ and total charge q only-independent of any specific driving input. Accordingly, Chua´s constitutive memristor relations are constructed explicitly for Williams´ famous TiO2 device in terms of q=q(φ). It is shown that this kind of model describes correctly the prevalent physical phenomena at the metal-oxide interfaces and is able to predict without any further parameters or assumptions, the dependence of Vset and Vreset voltages on the particular input voltage wave form. The impact of thermal (memory) effects on device performance is explored in numerical simulations.
  • Keywords
    Chua´s circuit; circuit complexity; memristor circuits; titanium compounds; Chua constitutive memristor relations; TiO2; electric flux; i-v characteristics; input voltage waveform; integrated memristor circuits; metal-oxide interfaces; numerical simulations; physical phenomena; thermal effects; Biological system modeling; Electrodes; Heating; Integrated circuit modeling; Ions; Mathematical model; Memristors; Memristor; titanium oxide;
  • fLanguage
    English
  • Journal_Title
    Emerging and Selected Topics in Circuits and Systems, IEEE Journal on
  • Publisher
    ieee
  • ISSN
    2156-3357
  • Type

    jour

  • DOI
    10.1109/JETCAS.2015.2435513
  • Filename
    7116609