DocumentCode
86937
Title
Numerical Simulation of the Overall Transfer Impedance of Shielded Spacecraft Harness Cable Assemblies
Author
Mora, Nicolas ; Rachidi, Farhad ; Pelissou, Patrice ; Junge, Axel
Author_Institution
EMC Lab., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Volume
57
Issue
4
fYear
2015
fDate
Aug. 2015
Firstpage
894
Lastpage
902
Abstract
In this paper, we present general considerations for the application of the multiconductor transmission-line theory for simulating shielded spacecraft harness cable assemblies. Some of the practical issues that occur in the modeling process of various components of cable assemblies in spacecraft applications, namely connectors, pigtails, and backshells are discussed. The overall transfer impedance of the assembly measured through a current injection with a pseudomicrostrip line is used as a figure of merit to evaluate the total shielding provided by the harness. Some of the parameters of the model were available from the manufacturers´ datasheets, while others were determined either experimentally or empirically. The position of the cables along the cross section was randomly assigned by the simulation tool. In general, the obtained simulation results are found to be in reasonable agreement with the experimental data. It is found that the generally overlooked contact impedances between the cable shields and connectors play a significant role, especially at low frequencies. The presented simulation results also emphasize the importance of the inductance and resistance of the connector backshell interconnection to the spacecraft chassis.
Keywords
electromagnetic shielding; microstrip lines; transmission line theory; connector backshell interconnection; multiconductor transmission-line theory; numerical simulation; overall transfer impedance; pseudomicrostrip line; shielded spacecraft harness cable assemblies; Assembly; Cable shielding; Connectors; Impedance; Power cables; Space vehicles; Wires; Cable shielding; multiconductor transmission line (MTL); transfer impedance;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/TEMC.2015.2404928
Filename
7054483
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