DocumentCode :
86937
Title :
Numerical Simulation of the Overall Transfer Impedance of Shielded Spacecraft Harness Cable Assemblies
Author :
Mora, Nicolas ; Rachidi, Farhad ; Pelissou, Patrice ; Junge, Axel
Author_Institution :
EMC Lab., Swiss Fed. Inst. of Technol., Lausanne, Switzerland
Volume :
57
Issue :
4
fYear :
2015
fDate :
Aug. 2015
Firstpage :
894
Lastpage :
902
Abstract :
In this paper, we present general considerations for the application of the multiconductor transmission-line theory for simulating shielded spacecraft harness cable assemblies. Some of the practical issues that occur in the modeling process of various components of cable assemblies in spacecraft applications, namely connectors, pigtails, and backshells are discussed. The overall transfer impedance of the assembly measured through a current injection with a pseudomicrostrip line is used as a figure of merit to evaluate the total shielding provided by the harness. Some of the parameters of the model were available from the manufacturers´ datasheets, while others were determined either experimentally or empirically. The position of the cables along the cross section was randomly assigned by the simulation tool. In general, the obtained simulation results are found to be in reasonable agreement with the experimental data. It is found that the generally overlooked contact impedances between the cable shields and connectors play a significant role, especially at low frequencies. The presented simulation results also emphasize the importance of the inductance and resistance of the connector backshell interconnection to the spacecraft chassis.
Keywords :
electromagnetic shielding; microstrip lines; transmission line theory; connector backshell interconnection; multiconductor transmission-line theory; numerical simulation; overall transfer impedance; pseudomicrostrip line; shielded spacecraft harness cable assemblies; Assembly; Cable shielding; Connectors; Impedance; Power cables; Space vehicles; Wires; Cable shielding; multiconductor transmission line (MTL); transfer impedance;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2015.2404928
Filename :
7054483
Link To Document :
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