Title :
Method for checking ohmic back contact on semiconductor wafers using 4-point-probe measurements
Author_Institution :
University of Liverpool, Department of Electrical Engineering and Electronics, Liverpool, UK
fDate :
10/1/1966 12:00:00 AM
Abstract :
A method is devised to check the ohmic back contact to semiconductor wafers. It is applied to determine the effectiveness of aluminium and nickel plating as a back contact on silicon ptype and ntype wafers, respectively, during the process of alloyed-junction fabrication.
Keywords :
semiconductors; testing;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19660310
