DocumentCode :
870123
Title :
Foreword contributions from the 10th topical meeting on electrical performance of electronic packaging
Author :
Prince, Jerry L. ; Katopis, G.
Author_Institution :
University of Arizona
Volume :
25
Issue :
2
fYear :
2002
fDate :
5/1/2002 12:00:00 AM
Firstpage :
127
Lastpage :
128
Keywords :
Educational institutions; Electromagnetic modeling; Electronics packaging; Frequency measurement; Power system modeling; Power transmission lines; Radio frequency; Semiconductor device modeling; Semiconductor device noise; Semiconductor device packaging;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2002.802778
Filename :
1049621
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=870123
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