Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

Author

Branch, Karen M Coperich ; Morsey, Jason ; Cangellaris, Andreas C. ; Ruehli, Albert E.

Author_Institution

Sandia Nat. Labs., Albuquerque, NM, USA

Volume

25

Issue

2

fYear

2002

fDate

5/1/2002 12:00:00 AM

Firstpage

129

Lastpage

135

Abstract

The development of a physically consistent multiconductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is presented which constructs SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion. Simulations using wideband measurement data of alumina demonstrate the effect of the Debye based permittivity model.

Keywords

SPICE; absorbing media; curve fitting; dielectric losses; impedance matrix; interconnections; multiconductor transmission lines; permittivity; transmission line theory; two-port networks; Debye based permittivity model; SPICE-compatible equivalent circuits; alumina; closed-form model; dielectric dispersion; dielectric loss; frequency-dependent losses; high-speed interconnects; impedance matrix; lossy dispersive dielectrics; multiconductor transmission line model; parameter extraction; per-unit-length conductance matrix; physically consistent transmission line models; two-port network model; vector curve fitting; wideband measurement data; Circuit simulation; Dielectric losses; Dispersion; Distributed parameter circuits; Equivalent circuits; Integrated circuit interconnections; Multiconductor transmission lines; Propagation losses; Transmission lines; Wideband;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2002.803309

Filename

1049622