Coupling between microstrip lines embedded in polyimide layers for 3D-MMICs on Si

Author

Ponchak, G.E. ; Tentzeris, E.M. ; Papapolymerou, J.

Author_Institution

NASA Glenn Res. Center, Cleveland, OH, USA

Volume

150

Issue

5

fYear

2003

Abstract

Three-dimensional circuits built on multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimetre-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrade circuit performance. We present finite difference time domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines. A discussion of the electric and magnetic field distributions for the coupled microstrip lines is presented to provide a physical rationale for the presented results

Keywords

CMOS integrated circuits <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; MIMIC <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; MMIC <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; electric fields <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; electromagnetic coupling <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; electromagnetic field theory <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; electromagnetic shielding <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; finite difference time-domain analysis <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; integrated circuit interconnections <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; magnetic fields <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; microstrip lines <embedded, polyimide layers for 3D-MMICs, Si, coupling>; transmission line theory <microstrip lines embedded, polyimide layers for 3D-MMICs, Si, coupling>; 3D-MMIC; CMOS wafers; FDTD analysis; Si; SiGe; electric field distribution; embedded microstrip line coupling; finite difference time domain analysis; magnetic field distribution; monolithic microwave integrated circuits; monolithic millimetre-wave integrated circuits; polyimide layers; shielding structures; silicon wafers;

fLanguage

English

Journal_Title

Microwaves, Antennas and Propagation, IEE Proceedings

Publisher

iet

ISSN

1350-2417

Type

jour

DOI

10.1049/ip-map:20030545

Filename

1262349