Modeling complex via hole structures

Author

Laermans, Eric ; De Geest, Jan ; De Zutter, Daniël ; Olyslager, Frank ; Sercu, Stefaan ; Morlion, Danny

Author_Institution

Dept. of Inf. Technol., Ghent Univ., Belgium

Volume

25

Issue

2

fYear

2002

fDate

5/1/2002 12:00:00 AM

Firstpage

206

Lastpage

214

Abstract

Derives a physics-based circuit model for complex via hole structures in printed circuit boards. The via hole is modeled as a cascade of capacitance and inductance matrices. Capacitance values are computed using a three-dimensional electrostatic solver and inductance values are computed from a two-dimensional quasi-TEM solver. This model is valid at frequencies up to a few gigahertz for typical via hole geometries, where the return current follows a well defined path.

Keywords

capacitance; circuit CAD; circuit simulation; electrostatics; inductance; printed circuit design; capacitance matrices; complex via hole structures; inductance matrices; physics-based circuit model; printed circuit boards; return current; three-dimensional electrostatic solver; two-dimensional quasi-TEM solver; Capacitance; Circuit simulation; Electrostatics; Finite difference methods; Frequency; Inductance; Integrated circuit interconnections; Printed circuits; Time domain analysis; Transmission line matrix methods;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2002.803310

Filename

1049631