DocumentCode :
870252
Title :
Inductance extraction for packages with adaptive non-orthogonal ground plane meshing
Author :
Lippens, Gunther ; De Zutter, Daniël
Author_Institution :
Dept. of Inf. Technol., Ghent Univ., Belgium
Volume :
25
Issue :
2
fYear :
2002
fDate :
5/1/2002 12:00:00 AM
Firstpage :
223
Lastpage :
229
Abstract :
A method is presented in which a geometry and frequency dependent precalculation of large pin count flat package ground plane currents is performed. We use this precalculation to construct an adaptive nonorthogonal partial element equivalent circuit (PEEC) grid for the correct modeling of the inductance matrix of packages with minimal ground plane discretizations needed. The method is illustrated for a 40-pin flat package. Special attention is given to the convergence and accuracy of the results as a function of the number of PEEC filaments, demonstrating the superiority of the adaptive meshing.
Keywords :
current distribution; equivalent circuits; inductance; mesh generation; packaging; skin effect; PEEC; PEEC filaments; adaptive meshing; adaptive nonorthogonal ground plane meshing; adaptive nonorthogonal partial element equivalent circuit; convergence; flat package; flat package ground plane currents; frequency dependent precalculation; geometry; ground plane discretizations; inductance extraction; inductance matrix; packages; pin count; Capacitance; Conductors; Current distribution; Equivalent circuits; Frequency dependence; Geometry; Inductance; Packaging; Pins; Skin effect;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2002.803307
Filename :
1049633
Link To Document :
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