• DocumentCode
    870508
  • Title

    Off-line control of time-pressure dispensing processes for electronics packaging

  • Author

    Chen, X.B. ; Zhang, W.J. ; Schoenau, G. ; Surgenor, B.

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Saskatchewan, Saskatoon, Sask., Canada
  • Volume
    26
  • Issue
    4
  • fYear
    2003
  • Firstpage
    286
  • Lastpage
    293
  • Abstract
    Fluid dispensing is one critical process in electronics packaging, in which fluid materials (such as encapsulant, adhesive) are delivered controllably onto substrates for the purpose of encapsulation. Time-pressure dispensing is recently the most widely used approach, and its control has proven to be a challenging task due to the fact that the dispensing process performance is significantly affected by the behavior of the fluid dispensed. Moreover, if the fluid exhibits time-dependent behavior, the control becomes more difficult and demanding. This paper presents a method to model the time-pressure dispensing process, taking into account the time-dependent fluid behavior. Based on the model developed, an off-line control strategy is developed for improving the process performance. Experiments on a typical commercial dispensing system were carried out to verify the effectiveness of the modeling method and the off-line control strategy.
  • Keywords
    electronics packaging; integrated circuit manufacture; integrated circuit packaging; electronics packaging; encapsulation; fluid dispensing; fluid materials; model updating; off-line control; time-dependent fluid behavior; time-pressure dispensing; Electronics packaging; Encapsulation; Fasteners; Flip chip; Mechanical engineering; Needles; Surge protection; Thermal stresses; Viscosity; Wires;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2003.820824
  • Filename
    1262382