• DocumentCode
    870543
  • Title

    Boxes: An Engineering Methodology for Calculating Soft Error Rates in SOI Integrated Circuits

  • Author

    Fulkerson, David E. ; Nelson, David K. ; Carlson, Roy M.

  • Author_Institution
    Honeywell Aerosp. Plymouth, MN
  • Volume
    53
  • Issue
    6
  • fYear
    2006
  • Firstpage
    3329
  • Lastpage
    3335
  • Abstract
    A simple methodology is necessary to characterize the SEU behavior of large quantities of RAM cell types, latches, flip-flops, other logic cells, I/O cells, etc. Such a methodology, called "Boxes", is being used for the Honeywell S150 radiation-hard 0.15 mum partially-depleted SOI process. Using physics-based equations, this paper shows how to break up each critical transistor into several "boxes", each with its own dimensions and critical charge, for the purpose of calculating soft error rate (SER). The Boxes methodology also allows for calculation of SER due to an ion that must simultaneously strike two separated sensitive volumes in order to cause an upset. This can be the dominant upset mechanism for many types of cells such as certain hardened SRAM\´s and other cells that obtain radiation hardness via extra transistors (such as triple modular redundancy, the DICE latch, etc.). Boxes also predicts upsets that can occur when an ion strike pulls a circuit node below ground or above the positive power supply. The boxes methodology was applied to a 6 T non-hardened SRAM, a hardened SRAM, and a D-type flip-flop. The theoretical predictions correlated well with experimental vertical ion strike data
  • Keywords
    SRAM chips; bipolar transistors; flip-flops; monolithic integrated circuits; radiation hardening (electronics); silicon-on-insulator; CREME96; D-type flip-flop; DICE latch; Honeywell S150 radiation-hardness; I/O cells; RAM cell; SOI integrated circuits; boxes methodology; critical charge; hardened SRAM; logic cells; nonhardened SRAM; partially-depleted SOI process; positive power supply; soft error rates; triple modular redundancy; upset mechanism; Circuits; Equations; Error analysis; Flip-flops; Latches; Logic; Power supplies; Radiation hardening; Random access memory; Redundancy; CREME96; SEE; SEU; SOI; SPICE; SRAM; flip-flop; modeling;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2006.886150
  • Filename
    4033474