• DocumentCode
    870546
  • Title

    An investigation of bulk recycling planning for an electronics recycling facility receiving industrial returns versus residential returns

  • Author

    Lu, Qin ; Stuart, Julie Ann

  • Author_Institution
    Dept. of Ind., Ohio State Univ., Columbus, OH, USA
  • Volume
    26
  • Issue
    4
  • fYear
    2003
  • Firstpage
    320
  • Lastpage
    327
  • Abstract
    Since most end-of-life electronics equipment contain hazardous materials such as lead solder alloys or lead-impregnated glass, it is important to divert them from landfills. For end-of-life products that are not repairable and do not contain reusable parts, bulk recycling is an alternative to recover base materials. In this paper, we contrast production and recycling planning and distribution decisions, activities, and costs. We reveal that while a traditional production facility connects suppliers and customers, a recycling facility connects both "input" and "output" customers. As a result, decisions in short-term bulk recycling planning include what products to accept, what products to process and reprocess, and what products to carry in inventory. Many recyclers set prices to receive "input" based on experience. For various prices to receive "input", we use a new analytical model to investigate the sensitivity of the short-term bulk recycling planning decisions in products from two different sources: industrial returns versus residential returns. The results of the case study show that different decisions are recommended for the industrial returns versus the residential returns when the total quantity of the incoming products is equal.
  • Keywords
    electronic equipment manufacture; electronics industry; planning; recycling; bulk recycling planning; distribution activities; distribution costs; distribution decisions; electronics product; electronics recycling facility; end-of-life electronics; hazardous materials; industrial returns; lead solder alloys; lead-impregnated glass; production planning; residential returns; Costs; Electronic equipment; Electronics industry; Glass; Hazardous materials; Industrial electronics; Lead; Production facilities; Production planning; Recycling;
  • fLanguage
    English
  • Journal_Title
    Electronics Packaging Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-334X
  • Type

    jour

  • DOI
    10.1109/TEPM.2003.822080
  • Filename
    1262386