DocumentCode
870617
Title
Design and fabrication of an IC encapsulation mold adhesion force tester [Abstracts of Forthcoming Manuscripts]
Author
Shyang-Jye Chang ; Sheng-Jye Hwang
Author_Institution
National Cheng Kung University
Volume
26
Issue
4
fYear
2003
Firstpage
264
Lastpage
264
Keywords
Abstracts; Adhesives; Circuit testing; Digital integrated circuits; Electromagnetic compatibility; Encapsulation; Fabrication; Force measurement; Integrated circuit testing; Surface treatment;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2003.823165
Filename
1262395
Link To Document