• DocumentCode
    870658
  • Title

    Impact of Heavy-Ion Strikes on Minimum-Size MOSFETs With Ultra-Thin Gate Oxide

  • Author

    Gerardin, Simone ; Bagatin, Marta ; Cester, Andrea ; Paccagnella, Alessandro ; Kaczer, Ben

  • Author_Institution
    Dipt. di Ingegneria dell´´Informazione, Padova Univ.
  • Volume
    53
  • Issue
    6
  • fYear
    2006
  • Firstpage
    3675
  • Lastpage
    3680
  • Abstract
    We present new original experimental results on the effects produced by single heavy-ion strikes on minimum-size MOSFETs manufactured in a 0.1-mum CMOS technology. We show that, whereas large-width samples do not suffer from any particular degradation when struck by a single ion, minimum size devices, which are the real building block of modern digital circuits, display small but significant changes in the electrical characteristics. In particular, we identify and classify the different types of degradation occurring after irradiation with high-LET particles and attribute them to ion strikes occurring in different parts of the MOSFET: gate oxide, LDD spacers, and STI. Even though the observed changes do not compromise the device functionality, they clearly indicate that, as the feature size is scaled into the decananometer range, single heavy-ion strikes will have a growing effect on digital circuits
  • Keywords
    CMOS digital integrated circuits; MOSFET; ion beam effects; 0.1 micron; CMOS technology; LDD spacers; degradation; electrical characteristics; gate oxide; high-LET particles; irradiation effect; minimum size MOSFET; modern digital circuits; single heavy-ion strike impact; ultra-thin gate oxide; CMOS technology; Degradation; Digital circuits; Displays; Electric breakdown; Electric variables; Helium; Leakage current; MOSFETs; Manufacturing; CMOS; heavy ions;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.2006.885374
  • Filename
    4033509