DocumentCode
870658
Title
Impact of Heavy-Ion Strikes on Minimum-Size MOSFETs With Ultra-Thin Gate Oxide
Author
Gerardin, Simone ; Bagatin, Marta ; Cester, Andrea ; Paccagnella, Alessandro ; Kaczer, Ben
Author_Institution
Dipt. di Ingegneria dell´´Informazione, Padova Univ.
Volume
53
Issue
6
fYear
2006
Firstpage
3675
Lastpage
3680
Abstract
We present new original experimental results on the effects produced by single heavy-ion strikes on minimum-size MOSFETs manufactured in a 0.1-mum CMOS technology. We show that, whereas large-width samples do not suffer from any particular degradation when struck by a single ion, minimum size devices, which are the real building block of modern digital circuits, display small but significant changes in the electrical characteristics. In particular, we identify and classify the different types of degradation occurring after irradiation with high-LET particles and attribute them to ion strikes occurring in different parts of the MOSFET: gate oxide, LDD spacers, and STI. Even though the observed changes do not compromise the device functionality, they clearly indicate that, as the feature size is scaled into the decananometer range, single heavy-ion strikes will have a growing effect on digital circuits
Keywords
CMOS digital integrated circuits; MOSFET; ion beam effects; 0.1 micron; CMOS technology; LDD spacers; degradation; electrical characteristics; gate oxide; high-LET particles; irradiation effect; minimum size MOSFET; modern digital circuits; single heavy-ion strike impact; ultra-thin gate oxide; CMOS technology; Degradation; Digital circuits; Displays; Electric breakdown; Electric variables; Helium; Leakage current; MOSFETs; Manufacturing; CMOS; heavy ions;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.2006.885374
Filename
4033509
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