DocumentCode
870660
Title
Processing and reliability of CSPs with underfill [Abstracts of Forthcoming Manuscripts]
Author
Jing Liu ; Johnson, R. Wayne ; Yaeger, E. ; Konarski, Michal ; Crane, Laura
Author_Institution
Auburn University
Volume
26
Issue
4
fYear
2003
Firstpage
265
Lastpage
265
Keywords
Abstracts; Assembly; Chip scale packaging; Cranes; Electric shock; Electronic packaging thermal management; Industrial electronics; Rapid thermal processing; Recycling; Testing;
fLanguage
English
Journal_Title
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
1521-334X
Type
jour
DOI
10.1109/TEPM.2003.823163
Filename
1262399
Link To Document