Title :
Forward Body Biasing as a Bulk-Si CMOS Technology Scaling Strategy
Author :
Hokazono, Akira ; Balasubramanian, Sriram ; Ishimaru, Kazunari ; Ishiuchi, Hidemi ; Hu, Chenming ; Liu, Tsu-Jae King
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California at Berkeley, Berkeley, CA
Abstract :
Forward body biasing is a promising approach for realizing optimum threshold-voltage (V TH) scaling in the era when gate dielectric thickness can no longer be scaled down. This is confirmed experimentally and by simulation of a 10-nm gate length MOSFET. Because forward body bias (VF) decreases the depletion width (X DEP) in the channel region, it reduces V TH rolloff significantly. MOSFET performance is maximized under forward body bias with steep retrograde channel doping, and such channel doping profiles are required to accomplish good short-channel behavior (small X DEP ) at low V TH notwithstanding body bias; therefore, the combination of forward body biasing with steep retrograde channel doping profile can extend the scaling limit of conventional bulk-Si CMOS technology to 10-nm gate length MOSFET. Considering forward biased p-n junction current, parasitic bipolar transistor, and CMOS latch-up phenomena, the upper limit for |VF| should be set at 0.6-0.7 V, which is sufficient to realize significant advantages of forward body biasing.
Keywords :
CMOS integrated circuits; CMOS latch-up; CMOS technology scaling strategy; MOSFET; Si; channel doping profiles; channel region; forward biased p-n junction current; forward body bias; optimum threshold-voltage scaling; parasitic bipolar transistor; Bipolar transistors; CMOS technology; Dielectrics; Doping profiles; MOSFET circuits; P-n junctions; Research and development; Scalability; Substrates; Voltage control; Body bias; MOSFET; forward body bias; retrograde channel doping profile; reverse body bias; steep channel doping profile; substrate bias; work function;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2008.2003029