• DocumentCode
    871275
  • Title

    Irradiated Silicon Gate MOS Device Bias Annealing

  • Author

    Schwank, James R. ; Dawes, William R., Jr.

  • Author_Institution
    Sandia National Laboratories P.O. Box 5800 Albuquerque, NM 87185
  • Volume
    30
  • Issue
    6
  • fYear
    1983
  • Firstpage
    4100
  • Lastpage
    4104
  • Abstract
    N-channel silicon gate MOS transistors exhibit positive threshold shifts when bias annealed following ionizing irradiation exposure. The threshold shift is probably due to electrons tunneling into the oxide and recombining at trapping centers near the Si/Sio2 interface. The threshold shifts are large enough in some cases to cause functional failures of MOS integrated circuits.
  • Keywords
    Annealing; Electrons; Interface states; Ionizing radiation; Laboratories; MOS devices; MOSFETs; Silicon; Temperature; Threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/TNS.1983.4333089
  • Filename
    4333089