DocumentCode
871275
Title
Irradiated Silicon Gate MOS Device Bias Annealing
Author
Schwank, James R. ; Dawes, William R., Jr.
Author_Institution
Sandia National Laboratories P.O. Box 5800 Albuquerque, NM 87185
Volume
30
Issue
6
fYear
1983
Firstpage
4100
Lastpage
4104
Abstract
N-channel silicon gate MOS transistors exhibit positive threshold shifts when bias annealed following ionizing irradiation exposure. The threshold shift is probably due to electrons tunneling into the oxide and recombining at trapping centers near the Si/Sio2 interface. The threshold shifts are large enough in some cases to cause functional failures of MOS integrated circuits.
Keywords
Annealing; Electrons; Interface states; Ionizing radiation; Laboratories; MOS devices; MOSFETs; Silicon; Temperature; Threshold voltage;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/TNS.1983.4333089
Filename
4333089
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