DocumentCode :
871275
Title :
Irradiated Silicon Gate MOS Device Bias Annealing
Author :
Schwank, James R. ; Dawes, William R., Jr.
Author_Institution :
Sandia National Laboratories P.O. Box 5800 Albuquerque, NM 87185
Volume :
30
Issue :
6
fYear :
1983
Firstpage :
4100
Lastpage :
4104
Abstract :
N-channel silicon gate MOS transistors exhibit positive threshold shifts when bias annealed following ionizing irradiation exposure. The threshold shift is probably due to electrons tunneling into the oxide and recombining at trapping centers near the Si/Sio2 interface. The threshold shifts are large enough in some cases to cause functional failures of MOS integrated circuits.
Keywords :
Annealing; Electrons; Interface states; Ionizing radiation; Laboratories; MOS devices; MOSFETs; Silicon; Temperature; Threshold voltage;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.1983.4333089
Filename :
4333089
Link To Document :
بازگشت