Impact of Shear Strain and Quantum Confinement on $\langle \hbox {110}\rangle$ Channel nMOSFET With High-Stress CESL

In this paper, we propose a new analytical electron mobility model in strained Si inversion layers suitable for implementation in a drift-diffusion simulator. Using our new model, a numerical study in conjunction with comprehensive bending experiments has demonstrated that (100)-Si has the optimum channel direction along <110> in terms of the device performance of strained 65-nm-node nMOSFETs with contact etch stop layer and that both the shear-strain component and the quantum confinement effect are key factors in contributing to this superiority.